The Innovation Marketplace, hosted by USAID and MIT, is a competition showcasing the talent of students and young innovators who are using science, technology, innovation and partnerships to tackle global challenges.


Teams or individuals can compete in ONE of two categories:

  • Products & services and

Products & services are approaches, technologies, devices, or systems with at least an existing prototype by the time of submission.

Research includes projects or methodologies that have collected preliminary data by the time of submission.

The Innovation Marketplace will take place in mid-November on MIT’s campus, which is located in the Boston area, as a feature of HESN’s TechCon 2016.

Throughout the course of the competition, individuals or teams of young innovators such as students, young professionals, or postdoctoral researchers will have the opportunity to gain exposure, build support for their innovative product or research, receive technical feedback, and practice their pitching skills.

Although all accepted applicants will be able to attend TechCon, the final round of winners from each category will receive financial and/or mentorship support.

Submission Guidelines:

Ready to submit your innovation? Read the application guidelines and get started on your application today!

Deadline for submission of innovation: May 31, 2016

For questions about the Innovation Marketplace, please email techcon@usaid.gov.

You definitely need to visit the main website for more information, so visit it Here!

Good Luck as you apply!

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